Silicon Devices and Process Integration

Deep Submicron and Nano-Scale Technologies

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Bibliografische Daten
ISBN/EAN: 9780387367989
Sprache: Englisch
Umfang: xxvi, 598 S.
Format (T/L/B): 3.6 x 24.1 x 16.5 cm
Auflage: 1. Auflage 2009
Einband: gebundenes Buch

Beschreibung

InhaltsangabeSilicon Properties.- Junctions and Contacts.- The Bipolar Transistor.- The MOS Structure.- Insulated-Gate Field-Effect Transistor.- Analog Devices and Passive Components.- Enabling Processes and Integration.- Applications.

Leseprobe

Leseprobe

Inhalt

Properties of the Silicon Crystal. Valence-bond and energy-band models. Thermal equilibrium statistics. Carrier transport mechanisms. Non-equilibrium conditions and carrier lifetime.- Junctions and Contacts. Ohmic, non-ohmic, and rectifying contacts. PN junctions, homo- and hetero-junctions. Contact und junction characterization, parameter extraction. Varactors.- Junction Field-Effect Transistor, JFET. Structure and mode of operation. Physics of JFET. JFET characterization and parameter extraction. High-voltage applications. Parasitic effects.- Bipolar Junction Transistor, BJT. Structure and mode of operation. Physics of BJT. Heterojunction Bipolar Transistor, HBT. Transistor characterization and parameter extraction. High-voltage applications.- Parasitic effects.

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Springer Verlag GmbH
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